EPFL and ETH (Switzerland) are undertaking a four year project named CMOSAIC with the goal of extending Moore’s law into the third dimension:
“Unlike current processors, the CMOSAIC project considers a 3D stack-architecture of multiple cores with a interconnect density from 100 to 10,000 connections per millimeter square. Researchers believe that these tiny connections and the use of hair-thin, liquid cooling microchannels measuring only 50 microns in diameter between the active chips are the missing links to achieving high-performance computing with future 3D chip stacks.”
Just my personal opinion of course… but…. this seems like a case of fixing the symptoms rather than finding a cure. Will bringing a microfluidic angle into Moore’s law really help us out?
Why do we put up with this kind of heating problem in the first place? One could, for example, consider an alternative investment in the development of reversible, low disspation superconducting electronics.
I guess the project will be interesting just from a point of view of 3D manufacturing and incorporation of fluidics into microchips – this kind of technology could be indispensable for progress in areas such as lab-on-a-chip technology. But as far as raw processing power goes, this approach seems a bit like ignoring the elephant in the room.